Advanced Packaging
Zarlink?s Advanced Packaging division?s key expertise allows its customers to get products to market faster, easier and cost-effectively.
Advanced Packaging?s proven micro-packaging skills are behind smaller, faster and more reliable electronic components at the heart of mission-critical medical, telecom, industrial, and military applications. We?ve designed and assembled key technologies for ultra-reliable devices, including a module for the world?s smallest pacemaker and in-body antennas for wireless healthcare devices. Working with leading telecom providers, we have developed circuit solutions that deliver enhanced performance and a reduce board footprint versus individual integrated circuits.
Advanced Packaging?s end-to-end expertise includes integrated evaluation, design and development capabilities, supported by manufacturing facilities meeting the strictest medical and telecom standards, to help our customers improve performance, lower costs and ensure fast time-to-market.
What's NEW IN ADVANCED PACKAGING
- Dec 01, 2009 - Energy Harvesting Project Scoops IET Innovation Award
- Nov 11, 2008 - In-Body Microgenerator Converts Heartbeat into Electricity for Implanted Medical Devices
- Apr 11, 2007 - Zarlink Joins Consortium Developing ?Smart Flex? Packaging for the Miniaturization of Electronic Systems
Articles and Whitepapers
Read articles and whitepapers discussing the company's latest products and technology and market trends.
Conference Papers
Technology and market expertise from Zarlink










